It’s official, the MediaTek Dimensity 9300 chipset has been officially announced, complete with an innovative All Big Core design. The unique configuration basically combines extreme performance with MediaTek’s industry-leading power efficiency and is ready to take on the Qualcomm Snapdragon 8 Gen 3 as well as Apple’s A17 Pro in multi-core performance.
This chipset is built on TSMC’s third-gen 4nm process with four Arm Cortex-X4 cores boasting operating speeds of up to 3.25GHz and four Cortex-A720 cores operating up to 2.0GHz. To maximize versatility, it supports WQHD at 180Hz and 4K up to 120Hz to provide stunning visuals, along with dual active display support for foldable smartphones, while a 5G R16 modem supports 4CC-CA Sub-6GHz as well as 8CC-CA mmWave with MediaTek’s UltraSave 3.0+ technology. The first smartphones with the MediaTek Dimensity 9300 are set to arrive by the end of 2023.
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The Dimensity 9300 is MediaTek’s most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design. This unique architecture, combined with our upgraded on-chip AI Processing Unit, will usher in a new era of generative AI applications as developers push the limits with edge AI and hybrid AI computing capabilities,” said Joe Chen, President at MediaTek.
